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Smart Device / Semiconductor

Modules · Components

Display Modules, Camera Modules, and Metal Connectors are key components that enable the functionality and connectivity of electronic devices.

INLASER has consistently provided laser solutions optimized for high-precision welding and marking processes.

Key Processes: Modules & Components

Display Module Ablation & Texturing

Laser processing on modules and bodies to maximize bonding and reliability.

  • Improved Adhesion: Enhances bonding through surface texturing
  • Micro-ablation: Precision layer removal for process optimization
  • Damage-free: Selective processing with zero impact on surrounding areas

Camera Module Marking & Cutting

Enables high-density packaging through precise marking and cutting of camera modules.

  • Traceability Marking: High-precision ID engraving on housings and PCBs
  • Clean Laser Cutting: Burr-free, precise cutting for Flexible and Rigid PCBs
  • Compact Integration: Supports miniaturization with advanced micro-machining

Metal Connector Marking & Welding

Ensures stable device connectivity through precision welding and marking.

  • Precision Welding: High-quality laser joining for connector components
  • Integrated Traceability: Permanent ID marking on housings and PCBs
  • Reliable Connection: Uniform weld quality for stable power and data transfer